G - Physics – 01 – R
Patent
G - Physics
01
R
356/9
G01R 31/28 (2006.01) G01R 31/316 (2006.01)
Patent
CA 1301950
LSI SYSTEM INCLUDING A PLURALITY OF LSI CIRCUIT CHIPS MOUNTED ON A BOARD ABSTRACT OF THE DISCLOSURE An LSI system includes: a multi-layer print board; and a plurality of LSI circuit chips mounted on the multi-layer printed circuit board, each including a plurality of pins, a reference voltage terminal, a pin scan out terminal and a plurality of pin scan out circuits corresponding to the pins on a one-to-one basis. The multi-layer printed circuit board includes a reference voltage feeding layer formed therein in a form of a mesh or a sheet. By electrically connecting each reference voltage terminal of the plurality of LSI circuit chips to the reference voltage feeding layer, a substantially equal reference voltage can be fed to each LSI and a voltage drop thereof is reduced.
600317
Kono Takeshi
Yoshimura Tatsuro
Fujitsu Limited
Mcfadden Fincham
LandOfFree
Lsi system including a plurality of lsi circuit chips... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lsi system including a plurality of lsi circuit chips..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lsi system including a plurality of lsi circuit chips... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1299248