C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
356/1
C09K 19/00 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1291273
LYOTROPIC LIQUID CRYSTALLINE ORIENTED POLYMER SUBSTRATE FOR PRINTED WIRE BOARD ABSTRACT OF THE DISCLOSURE The present invention is directed to the use of ordered polymers as a substrate material for the preparation of printed wire boards (PWB). In the preferred embodiments, the PWB of the present invention comprises a generic, high density, organic multilayer PWB capable of being employed as a high density leadless perimeter and in grid array ceramic chip packages. Specific chip package density requirements are 0.020-in. centers with up to 300 input/outputs (I/Os) for perimeter type packages and 0.050- in. center grid array type packages with up to 240 I/Os per device. In its most preferred embodiments, the present invention is directed to a method of forming a PBT PWB substrate layer of 0.0025 in. or less in thickness. Another preferred aspect of the present invention concerns the discovery that a copper layer can be bonded to a PBT film substrate with a strength comparable to existing PWB materials.
583802
Lusignea Richard W.
Stevenson William A.
Foster-Miller Inc.
Ridout & Maybee Llp
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