Machine for automatically inserting parallel lead electronic...

H - Electricity – 03 – K

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356/187, 356/22

H03K 3/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1113613

MACHINE FOR AUTOMATICALLY INSERTING PARALLEL LEAD ELECTRONIC COMPONENTS INTO A PRINTED CIRCUIT BOARD ABSTRACT OF THE DISCLOSURE A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electro- nic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device. The electronic component thus received and gripped by the electronic component grip device is separated from the electronic component web carrier by a cutting device. The electronic component grip device gripping the electronic component separated by the cutting device is moved to the second predetermined position by a transfer device.

328970

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