Machines for board mounting and socket mounting components

H - Electricity – 05 – K

Patent

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26/139

H05K 3/30 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1090546

Abstract of the Disclosure Mechanism is provided whereby a machine for inserting multiple leads of a component into a circuit board may be adapted to first insert a lead-receivable socket into the board and thereafter mount a component in the pre-inserted socket. The mechanism preferably is employed in a machine comprising automatic means for sequencing the components and sockets predeterminedly. When the machine further comprises automatic means for positioning the circuit board to receive the successive components and/or sockets, it is contemplated all components and sockets will first be programmed to be inserted directly into the boards, then preferably after soldering to secure them into board circuitry and remounting of the board in the machine, new programming of the board positioning means will mount the proper component into its pre-inserted and soldered socket. The novel mechanism is provided, for instance, as an attachment to or auxiliary kit for use in a machine for inserting DIP components and/or sockets. Specifically this attachment comprises a movable stop having two abutment or positioning faces one of which is disposed to engage leading leads of a component and the other of which abuts the leading surface of a socket to be inserted. Mounting of the stop is such that it does not approach the circuit board and hence cannot interfere with it or previously mounted components.

306791

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