C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 17/00 (2006.01) C25D 7/00 (2006.01) C25D 17/10 (2006.01) C25D 21/10 (2006.01)
Patent
CA 2662464
To provide a plating apparatus capable of applying magnetic alloy plating having a uniform thickness and composition to the surface of a shaft-shaped member at a high speed. The plating apparatus 1 includes a plating tank 3 for storing a plating liquid 2, and applies the magnetic alloy plating to the shaft-shaped member 5 immersed in the plating liquid by using the shaft-shaped member 5 as a cathode. The plating apparatus 1 includes: rotating means 6 configured to rotate the shaft-shaped member 5 as a rotary shaft; annular shielding tools 13, 14 and 15 mounted on the outer peripheral surface of the shaft-shaped member 5; a plating liquid discharge nozzle 9 including plating liquid discharge ports 26 which are provided to face the shaft-shaped member 5 so as to avoid the shielding tools 13, 14 and 15; and an anode 10 provided around the shaft-shaped member 5 and the plating liquid discharge nozzle 9.
La présente invention concerne un appareil de placage qui peut appliquer à vitesse élevée un placage d'alliage magnétique ayant une épaisseur uniforme et une composition homogène à la surface d'un élément en forme de tige. Un appareil de placage (1) comporte un bain de placage (3) destiné à contenir un liquide de placage (2) et effectue le placage d'un élément en forme de tige (5) immergé dans ledit liquide, avec un alliage magnétique en utilisant ledit élément (5) comme cathode. Ledit appareil (1) comprend des moyens de rotation (6) destinés à faire tourner ledit élément (5) comme une tige rotative, des gabarits de protection annulaires (13, 14, 15) montés sur la face périphérique externe dudit élément (5), une buse d'éjection dudit liquide (11) comportant un orifice d'éjection dudit liquide (27) disposé de manière à faire face audit élément (5) tout en évitant lesdits gabarits (13, 14, 15), et une anode (10) disposée autour dudit élément (5) et de ladite buse (9).
Doi Mizuho
Harata Hitoshi
Karasawa Hitoshi
Kobayashi Koji
Yoshimoto Nobuhiko
Dennison Associates
Honda Motor Co. Ltd.
LandOfFree
Magnetic alloy plating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Magnetic alloy plating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetic alloy plating apparatus will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2019820