Magnetic bubble domain device package and method of assembly

Details Magnetic bubble domain device package and method of assembly Magnetic bubble domain device package and method of assembly

G - Physics

11

C

352/37.2

G11C 11/14 (2006.01) G11C 19/08 (2006.01)

Patent

CA 1155221

MAGNETIC BUBBLE DOMAIN DEVICE PACKAGE AND METHOD OF ASSEMBLY ABSTRACT OF THE DISCLOSURE A magnetic bubble domain device package and method of assembly thereof in which an integral rigid carrier is configured for receiving a magnetic bubble domain device chip and provides a frame for directly winding the drive coils thereon. The carrier also includes predetermined positions for the placement of bias magnets so as to obtain a uniform bias field directed at a prede- termined angle with respect to the chip. The rigid carrier is preferably injection molded to provide highly precise dimensions and placement of the various components of the package. - 1 -

367078

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