Magnetic heat sink for semiconductor ship

Details Magnetic heat sink for semiconductor ship Magnetic heat sink for semiconductor ship

H - Electricity

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H01L 23/34 (2006.01) H01L 23/373 (2006.01) H01L 23/42 (2006.01) H01L 23/433 (2006.01)

Patent

CA 1102010

MAGNETIC HEAT SINK FOR SEMICONDUCTOR CHIP ABSTRACT OF THE DISCLOSURE Heat generated in a multicontact semiconductor chip can be conducted away by the use of a magnetic fluid held in place by the field from a magnet which in turn conducts the heat transmitted through the fluid to a heat sink to which the magnet is bonded for thermal transfer.

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