Magnetic self-assembly for integrated circuit packages

Details Magnetic self-assembly for integrated circuit packages Magnetic self-assembly for integrated circuit packages

H - Electricity

01

L

H01L 23/32 (2006.01)

Patent

CA 2600611

An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.

Le boîtier de circuit intégré décrit peut comprendre un substrat et un circuit intégré. Le substrat peut comprendre au moins une zone, et un premier matériau magnétique associé à cette zone. Un second matériau magnétique peut être associé au circuit intégré. Le second matériau magnétique peut-être attiré par le premier matériau magnétique de manière à coupler le circuit intégré avec au moins une zone du substrat. Ce boîtier CI peut être utilisé dans une étiquette RFID ou un système RFID. L'invention concerne en outre un procédé correspondant, permettant d'assembler un circuit intégré à un substrat.

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