H - Electricity – 01 – J
Patent
H - Electricity
01
J
204/167.2
H01J 37/34 (2006.01)
Patent
CA 1141704
ABSTRACT OF THE DISCLOSURE A magnetically enhanced sputtering device including magnet means for establishing a magnetic field where the lines of force thereof extend over and may pass through the cathode sputtering surface at one predetermined area thereof. Preferably, the majority of the lines of force passing through said predeter- mined area of the sputtering surface are inclined at angles of 45° or less with respect to the surface. The magnet means may be disposed on the side of the cathode opposite the sputtering surface where the flux therein extends substantially parallel to the sputtering surface. Means for shaping the magnetic field at least along the direction of the lines of force may also be provided where the field shaping means may render the lines of force more parallel to the sputtering surface to thereby enhance uniformity of eros- ion of the sputtering surface at least in the direction of the lines of force and/or the field shaping may cause the lines of force to be substantially perpendicular to an edge of the sput- tering surface to thereby substantially limit erosion of the sputtering surface beyond the edge. The magnet means may cause a closed loop configuration of the lines of force where the closed loop configuration has at least some non-linear portions. Preferably flexible magnetic means may be employed for enhancing the uniformity of the mag- netic field along the non-linear portions.
325126
Ridout & Maybee Llp
Vac-Tec Systems Inc.
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