Magnetically enhanced sputtering device including means for...

H - Electricity – 01 – J

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204/167.2

H01J 37/34 (2006.01)

Patent

CA 1153733

ABSTRACT OF THE DISCLOSURE Magnetically enhanced sputtering device including first and second magnets disposed adjacent opposite sides of the target where one of the magnets projects a field over the target surface and through the magnet on the other side, the magnets preferably comprising contacting layers of oriented ferrite impregnated tape. Included is magnetic structure for establishing a magnetic bridge circuit for sputtering magnetically permeable targets. Also included is magnetic structure where a third magnet is disposed beneath the cathode and the fields generated by the first and second magnets pass through the third magnet to enhance the parallelism of the field with respect to the target.

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