Magnetically sealed multichip integrated circuit package

Details Magnetically sealed multichip integrated circuit package Magnetically sealed multichip integrated circuit package

H - Electricity

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356/143

H01L 23/02 (2006.01) H01L 23/04 (2006.01) H01L 23/10 (2006.01) H01L 25/065 (2006.01)

Patent

CA 1246757

-13- Abstract of the Disclosure A magnetically sealed integrated circuit package (10) which includes a substrate (11) having a cavity (12) for holding multiple integrated circuit die (13), a ferroma- gnetic seal ring (16) which is fixed to the substrate around the die, and a magnet (23) which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.

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