Magnetostrictive alloy thin film electroplating

Details Magnetostrictive alloy thin film electroplating Magnetostrictive alloy thin film electroplating

C - Chemistry, Metallurgy

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D

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C25D 3/56 (2006.01) C25D 5/02 (2006.01) C25D 5/08 (2006.01) C25D 17/00 (2006.01) C25D 21/12 (2006.01) G11B 5/31 (2006.01) H01F 41/14 (2006.01) H01F 41/26 (2006.01)

Patent

CA 1141695

MAGNETOSTRICTIVE ALLOY THIN FILM ELECTROPLATING METHOD Abstract of the Disclosure A thin film of low magnetostriction Permalloy* 80% nickel - 20% iron ? 1% is electroplated onto a substrate in a bath having a ratio of from 5.8:1 to 23:1 ratio of Ni to Fe ions with a plating current density from 10 ma/cm2 - 200 ma/cm2 when plating in sheet form or an Ni/Fe ratio of from 25:1 to 86:1 with a current density of from 2 ma/cm2 - 60 ma/cm2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. The Fe++ ion concentration required is inverse to the circulation of bath fluid across the substrate. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solu- tion is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni++, 1.05 g/l of Fe ++, 25 g/l of H3BO3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6. * Trade Mark

288228

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