Magnetron cathode sputtering apparatus

Details Magnetron cathode sputtering apparatus Magnetron cathode sputtering apparatus

C - Chemistry, Metallurgy

23

C

204/96.08, 204/1

C23C 14/34 (2006.01) C23C 14/04 (2006.01) C23C 14/35 (2006.01) C23C 14/50 (2006.01) H01J 37/34 (2006.01)

Patent

CA 1225364

MAGNETRON CATHODE SPUTTERING APPARATUS ABSTRACT Described is a cylindrical magnetron cathode sputtering apparatus for the simultaneous coating of a large number of articles or substrates, comprising an evacuable coating chamber (10), a central cylindrical cathode (14) mounted in said coating chamber and a plurality of auxiliary cylindrical cathodes (15) also mounted in said coating chamber circumferentially of said central cathode, magnet assemblies mounted in said central cathode (39) and in each of said auxiliary cathodes (61), with means (27, 85) being provided for rotating each of said cathodes while maintaining the magnet assemblies therein stationery. A carrier (70, 72) for holding the articles to be coated is located between the central cathode auxiliary cathodes and includes a plurality of article supports arranged circumferentially of the central cathode, said article supports being rotatable as well as being caused to revolve around the central cathode in planetary fashion. Also described is method of sputter coating utilizing the apparatus.

449813

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