Magnetron cathode sputtering apparatus

Details Magnetron cathode sputtering apparatus Magnetron cathode sputtering apparatus

C - Chemistry, Metallurgy

23

C

204/96.08, 204/1

C23C 15/00 (1980.01)

Patent

CA 1183103

MAGNETRON CATHODE SPUTTERING APPARATUS Abstract A rotatable magnetron cathode sputtering apparatus for operation within an evacuable chamber for coating substrates that are also contained with said chamber. The cathode com- prises an elongated cylindrical tube (120) having a layer (122) of the coating material or materials to be sputtered applied to the outer surface thereof. Magnetic means (126) is mounted with the tube and includes at least one row of permanent U-shaped magnets (164) extending lengthwise of the tube. The tube is horizontally disposed and rotatably mounted in the coating chamber (121) such that it can be turned on its longitudinal axis relative to the magnets (164) to selectively bring different portions or segments of the same sputtering material or different sputtering materials into sputtering position with respect to the magnets and with the magnetic field. Means is also provided for internally cooling the cathode.

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