Magnetron cathode sputtering system

Details Magnetron cathode sputtering system Magnetron cathode sputtering system

H - Electricity

01

J

356/178, 356/192

H01J 37/34 (2006.01) C23C 14/34 (2006.01) H01L 21/00 (2006.01) H01L 21/683 (2006.01)

Patent

CA 1192318

ABSTRACT: Magnetron cathode sputtering system. By connecting in a magnetron cathode sputtering system the target (plate of material to be sputtered) 8 against the backing plate 13 by vacuum suction, the back- ing plate 13 may be used over and over again. By moreover providing the backing plate with a layer of soldering material which does adhere to the said backing plate 13 but does not adhere to the target 8, the heat transfer between the two plates can be improved.

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