Magnetron sputtering apparatus

Details Magnetron sputtering apparatus Magnetron sputtering apparatus

C - Chemistry, Metallurgy

23

C

204/167.2

C23C 14/00 (2006.01) C23C 14/34 (2006.01) H01J 37/34 (2006.01)

Patent

CA 1193227

SPUTTERING APPARATUS AND METHOD ABSTRACT OF THE DISCLOSURE A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the work- piece to produce higher yield from a given cathode target.

415872

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