C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
204/167.2
C23C 14/35 (2006.01) H01J 37/317 (2006.01) H01J 37/34 (2006.01)
Patent
CA 2008934
A magnetron sputtering apparatus contains an inner magnetic pole, an outer magnetic pole having a polarity opposite to that of the inner magnetic pole and arranged to surround the inner magnetic pole, and a target disposed on at least above the inner magnetic pole and extending therefrom towards the outer magnetic pole. Each of the magnetic poles is of a soft magnetic material divided into plural discrete sections by a substance having a narrow width and a small permeability or by a slit is mounted on a back side of the target between the inner and outer magnetic poles so as to decrease the gradient of a vertical magnetic field at a central portion between the inner and outer magnetic poles yet to increase it at a portion in the vicinity of the magnetic poles and so as to make the distribution of intensity of a horizontal component of the magnetic field in an M-shaped form between the magnetic poles. The number of the sections of the soft magnetic material and the width of the substance or the slit are set in accordance with magnetic characteristics and a thickness of the target.
Arita Yoji
Mitsubishi Chemical Corporation
Sim & Mcburney
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