Magnetron sputtering cathode assembly and magnet assembly...

C - Chemistry – Metallurgy – 23 – C

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204/167.2

C23C 14/34 (2006.01) H01J 37/34 (2006.01)

Patent

CA 1246492

MAGNETRON SPUTTERING CATHODE ASSEMBLY AND MAGNET ASSEMBLY THEREFOR Abstract of the Disclosure A planar magnetron sputtering cathode assembly especially for simultaneously heating and coating substrates is also adaptable to a cool substrate operation. The cathode assembly features an efficient magnetic circuit using magnet assemblies enclosed within the sputtering chamber using minimal air gaps for magnetic efficiency and high-strength magnets to produce a high field at the sputtering target, and stainless steel cladding of the magnets to protect the magnets as well as to prevent out-gasing from the magnet material. A heat sink fills the space between the magnets to provide excellent cooling of the magnets as well as cooling of the target which seats directly on the heat sink. The target is held in place by bolts to facilitate rapid target changing.

482056

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