Magnetron sputtering gun

Details Magnetron sputtering gun Magnetron sputtering gun

C - Chemistry, Metallurgy

23

C

C23C 14/35 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2273294

A magnetron sputtering gun for coating a substrate with a thin coating under vacuum. The magnetron sputtering gun has a chamber having means to generate a magnetic field therein and means to effect sputtering from a target to said substrate to be coated. The sputtering gun has metal-metal seals, formed using copper gaskets at the vacuum sealing surfaces, preferably with the target is clamped to an upper plate that is vacuum brazed in position e.g. to a standard Conflat flange. The cooling water in the magnetron is separated from magnets that generate the magnetic field, to isolate said magnets from corrosive effects of the cooling water and to permit replacement thereof. The magnetron sputtering gun may be operated at lower pressures than guns with O-rings. The magnetron sputtering gun may be used in the coating of a variety of substrates e.g. semi-conductors, glass, insulators, ceramics and metals, which might otherwise not be possible using conventional magnetrons.

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