Magnetron sputtering method and apparatus

Details Magnetron sputtering method and apparatus Magnetron sputtering method and apparatus

C - Chemistry, Metallurgy

23

C

C23C 14/04 (2006.01) C23C 14/35 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2362146

An elongate emitter (22) is used as a cathode to coat material onto a cylindrical workpiece (12) by magnetron sputtering. Where the inside surface of the workpiece is coated, the workpiece itself is used as the vacuum sputtering chamber. The overlap between the plasma field and the magnetic field creates a coating zone which is moved along the length of the workpiece to evenly coat the workpiece.

La présente invention concerne un dispositif d'émission allongé (22) utilisé comme cathode et servant à recouvrir de matière une pièce cylindrique (12) par pulvérisation au magnétron. Lorsque la surface intérieure de la pièce est recouverte, la pièce s'utilise comme chambre de pulvérisation à vide. Le chevauchement entre le champ de plasma et le champ magnétique crée une zone de revêtement déplacée sur la longueur de la pièce afin de la recouvrir uniformément.

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