Making coplanar layers of thin films

Details Making coplanar layers of thin films Making coplanar layers of thin films

H - Electricity

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204/96.07

H01L 23/522 (2006.01) H01L 21/027 (2006.01) H01L 21/312 (2006.01) H01L 21/768 (2006.01) H01L 21/84 (2006.01) H05K 3/14 (2006.01)

Patent

CA 1062658

MAKING COPLANAR LAYERS OF THIN FILMS ABSTRACT A method for forming coplanar thin films, particularly conductor-insulator patterns, on a substrate. A pattern which includes a first thin film and an expendable material deposited thereon is formed on the substrate. The expendable material is selected so that it can be selectively removed by an etchant which does not attack the first thin film or an insulator which is to be deposited. The second thin film is deposited by RF sputtering at a bias which is sufficiently high to cause sub- stantial reemission of the second film. This results in the covering of the exposed substrate surfaces and the upper surface of the material with the second film but leaving the side sur- faces of the material exposed. The expendable material is then chemically etched so as to lift-off both the material and the second film deposited thereon, thereby leaving a coplanar pat- tern of first and second thin films.

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