Making low fusion bimodal vinyl dispersion resines as powder

C - Chemistry – Metallurgy – 08 – L

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Details

400/6418, 400/65

C08L 27/08 (2006.01) C08F 259/04 (2006.01)

Patent

CA 1210185

ABSTRACT OF THE DISCLOSURE There is disclosed a process for producing low energy vinyl dispersion resins which, in a plastisol, can be fused either at lower temperatures or in a shorter period of time than the normal dispersion grade resins presently employed. The new vinyl resin is characterized by being a bimodal resin, i.e., containing large particles and small particles of polymer in a predetermined size and amount. The small particles are a vinyl homopolymer or copolymer made by a regular emulsion polymerization procedure. The large particles are a vinyl copolymer made employing a seeded emulsion ovarpolymerization procedure wherein the seed is either a vinyl homopolymer or a vinyl copolymer. The final bimodal resin is obtained from a blend of the small and large particle latices by drying, such as spray drying, for example.

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