B - Operations – Transporting – 27 – N
Patent
B - Operations, Transporting
27
N
18/1011
B27N 3/18 (2006.01) B27N 3/06 (2006.01) B27N 3/08 (2006.01) B27N 3/24 (2006.01)
Patent
CA 2015229
A fiber or chip board is made by first forming a mixture of a binder and particles having a relatively low moisture content that is substantially less than a relatively high moisture content that a finished board should have. This mixture is deposited as a mat on a movable substrate so that the mat is substantially at ambient temperature and has the relatively low moisture content. Then the mat is preheated with steam to raise its temperature and to increase its moisture content to the predetermined relatively high moisture content. The thus preheated mat, whose moisture content has been corrected, is then simultaneously heated and compressed to form it into a board.
Panneau de fibres ou de copeaux fabriqué d'abord par le formage d'un mélange de liant et de particules ayant un degré d'humidité bas, sensiblement inférieur au taux relativement élevé que devrait présenter un panneau fini. Le mélange est déposé comme mat sur un subjectile en mouvement, le mat étant sensiblement à la température ambiante et possédant un degré d'humidité relativement faible. Le mat est ensuite préchauffé à la vapeur pour que sa température monte et pour que son degré d'humidité atteigne un niveau relativement élevé. Le mat ainsi préchauffé, dont le degré d'humidité a été corrigé, est simultanément chauffé et comprimé pour former un panneau.
Fischer Tilman
Sitzler Hans-Dietrich
Ufermann Werner
Borden Ladner Gervais Llp
Fischer Tilman
Siempelkamp Maschinen- Und Anlagenbau Gmbh & Co. Kg
Sitzler Hans-Dietrich
Ufermann Werner
LandOfFree
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