H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12
H05K 3/06 (2006.01) H01L 21/48 (2006.01) H01L 23/495 (2006.01) H05K 3/40 (2006.01)
Patent
CA 1124407
MANUFACTURE OF BUMPED COMPOSITE TAPE FOR AUTOMATIC GANG BONDING OF SEMICONDUCTOR DEVICES Abstract of the Disclosure A composite tape product, employed in the gang bonding of semiconductor devices, is manufactured on an insulating strip that has a series of apertures therein. A plurality of metal fingers are bonded to the strip so that groups of fingers extend over the apertures. The finger ends terminate in a configuration where each finger mates with an intergrated circuit bonding pad. A thermocom- pression bonding tool can then gang bond the fingers to the bonding pads. The tape mounted fingers then include the bonded chip and the tape can then carry the chip to the chip mounting and finger bonding operation. The composition tape is manufactured using mating prepunched or pre-etched insulating and metal strips. The metal strip is first partly etched to define the finger pattern. Then the metal and insulating strips are bonded together so that the partly defined finger patterns register with the prepunched insulating tape aper- tures. Then the finger etching is completed to term the composite tape that can be used in automatic assembly machines.
332304
Macrae & Co.
National Semiconductor Corporation
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