Manufacture of chipboard and a novel suitable bonding agent

Details Manufacture of chipboard and a novel suitable bonding agent Manufacture of chipboard and a novel suitable bonding agent

C - Chemistry, Metallurgy

08

L

400/5451, 400/73

C08L 61/30 (2006.01) B27N 3/00 (2006.01) C08G 12/12 (2006.01) C08G 12/38 (2006.01) C08L 97/02 (2006.01) C09J 161/30 (2006.01)

Patent

CA 1206655

11 MANUFACTURE OF PARTICLEBOARD AND A NOVEL SUITABLE BONDING AGENT Abstract of the Disclosure An improved method for the preparation of particleboard wherein a cellulose-containing particulate material is provided with a urea formaldehyde resin bonding agent and thereafter shaped and hardened at an elevated temperature and pressure. The bonding agent used is a urea-formaldehyde resin solution additionally containing melamine in an amount of 1.0 and 10 percent by weight, relative to the total amount of resin solids. The molar ratio of formaldehyde to mole equivalents of amino groups in the bonding agent is in the range of between 0.500 : 1 and 0.575 : 1.

400645

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