Manufacture of printed circuit board assemblies

Details Manufacture of printed circuit board assemblies Manufacture of printed circuit board assemblies

B - Operations, Transporting

23

K

148/60, 356/8

B23K 35/36 (2006.01) B23K 35/363 (2006.01)

Patent

CA 2020994

ABSTRACT MANUFACTURE OF PRINTED CIRCUIT BOARD ASSEMBLIES To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.

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