C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 7/02 (2006.01) B29C 41/14 (2006.01) C08C 1/15 (2006.01) C08J 5/02 (2006.01) C08L 11/02 (2006.01) C08L 75/04 (2006.01)
Patent
CA 2128670
A powder-free coagulant for use in latex dipping processes comprises a salt stable dispersion of a polymer eg a chlorinated rubber and an inorganic coagulant. Optionally the coagulant will also contain a powder-free release agent, to aid release of the dipped article from the former, comprising a polyethylene wax emulsion and a cationic surfactant.
Gerber Nevin D.
Gromelski Stanley J.
Nile Jeffery G.
Ansell Healthcare Products Llc
Riches Mckenzie & Herbert Llp
Smith & Nephew Inc.
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