Manufacture of thin film thermal print head

Details Manufacture of thin film thermal print head Manufacture of thin film thermal print head

G - Physics

03

F

314/41, 149/5

G03F 7/00 (2006.01) B41J 2/335 (2006.01) H05K 3/10 (2006.01)

Patent

CA 1109927

Abstract of the Disclosure A dielectric substrate for a thin film dot matrix thermal print head has its working surface etched or otherwise treated to selectively remove the dielectric material, in all areas which will constitute electrical connectors for the resistance heater print elements, to a depth approximately equal to the sum of the thicknesses of all of the conductive films to be applied to the substrate surface in those areas, following which the working surface of the substrate is selectively coated with films of high- resistance electrically conductive material and low- resistance conductive material, with suitable adhesion films as required, to complete the print head. An outer protective wear-resistant film is also employed. The resultant print head has its resistance heater print elements raised at least to the same level as the outer surfaces of the electrical connectors, and preferably slightly higher, to provide improved performance and operating life.

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