C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/04 (2006.01) C08L 63/02 (2006.01)
Patent
CA 2511566
The present invention provides a resin composition useful in manufacturing void free laminates. The resin composition comprises (a) from about 45 to about 65 weight percent of a glycidyl ether of phenolic novolac resin; (b) from about 5 to about 20 weight percent of a bisphenol A epoxy semi-solid resin; and (c) from about 10 to about 30 weight percent of a bisphenol A epoxy liquid resin.
Boyd Jack
Mortimer Steve
Peake Steve
Repecka Linas
Xu Guo Feng
Cytec Technology Corp.
Cytec Technology Corporation
Mcfadden Fincham
LandOfFree
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