Manufacture of void-free laminates and use thereof

Details Manufacture of void-free laminates and use thereof Manufacture of void-free laminates and use thereof

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01)

Patent

CA 2511567

The present invention provides a resin composition useful in manufacturing void-free laminates. The resin composition comprises: (a) from about 70 to about 90 weight percent of a tris (hydroxyphenyl)methane based epoxy semi-solid resin; and (b) from about 10 to about 30 weight percent of a tetraglycidylmethylenedianiline liquid resin.

Affiliated with

Also associated with

Rating

Manufacture of void-free laminates and use thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacture of void-free laminates and use thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture of void-free laminates and use thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1746465