Manufacture of void-free laminates and use thereof

Details Manufacture of void-free laminates and use thereof Manufacture of void-free laminates and use thereof

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08K 5/21 (2006.01) C08K 5/3445 (2006.01) C08L 63/02 (2006.01) C08L 63/04 (2006.01)

Patent

CA 2511569

The invention provides a resin composition useful in the preparation of void-free laminates. The resin composition comprises (a) from about 20 to about 30 weight percent of a glycidyl ether of cresol novolac resin; (b) from about 35 to about 45 weight percent of a tetraglycidylmethylenedianiline resin; (c) from about 14 to about 26 weight percent of a bisphenol A epoxy liquid resin; and (d) from about 0 to about 8 weight percent of a bisphenol A epoxy solid resin.

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