C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1201, 400/13
C08L 61/10 (2006.01) B32B 21/02 (2006.01) C08L 61/20 (2006.01) B29J 5/02 (1980.01)
Patent
CA 1065076
Abstract of the Disclosure A gelatinized amylaceous material, modified with a nitrogen containing compound such as urea, is combined with a synthetic resin, and the mixture is used as a binder which is particularly useful in producing compression molded particle board.
251897
Alexander Richard J.
Krueger Robert K.
LandOfFree
Manufacturing compression molded particle board with... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing compression molded particle board with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing compression molded particle board with... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-894298