Manufacturing corrugated board

B - Operations – Transporting – 31 – F

Patent

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B31F 1/20 (2006.01) B31F 1/28 (2006.01)

Patent

CA 2112116

Corrugated paperboards are prepared for corrugation and adhesive bonding of mediums and liners is promoted by expos- ing the mediums liners and adhesives to radiant energy from a thermal source ranging from 1100 °C to 2300 °C and emitting a dominant wavelength in the range of 2.1 to 1.0 microns. The speed of adhesive bond development is increased. Polymeric adhe- sives may be used as alternatives to conventional starch based adhesives.

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