G - Physics – 06 – K
Patent
G - Physics
06
K
G06K 19/077 (2006.01) H05K 1/11 (2006.01) H05K 3/10 (2006.01) H05K 13/00 (2006.01)
Patent
CA 2638256
The method for manufacturing a dual interface card comprises at least the following step: - collocating multiple card support sheets one onto the other, some of these sheets showing holes, in order to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess - depositing a conductive adhesive onto the contact pads - positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive - executing one single lamination step of the sheets with the module in order to: - laminate the multiple layers together in order to form the card body - embed the dual interface module in the recess and - achieve the curing of the isotropic conductive adhesive and the permanent electrical contact between the antenna and the dual interface module.
Ayala Stephane
Carre Lionel
Curty Jari-Pascal
Assa Abloy Ab
Robic
LandOfFree
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