Manufacturing method for tempered glass circuit board

Details Manufacturing method for tempered glass circuit board Manufacturing method for tempered glass circuit board

H - Electricity

05

K

H05K 3/10 (2006.01) C03B 25/02 (2006.01) C03B 32/00 (2006.01) C03C 17/10 (2006.01) C03C 17/40 (2006.01) H05B 3/84 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2394932

Manufacturing method for tempered glass circuit board, including steps of: by means of a halftone, evenly painting a layer of silver plasma onto the surface of a glass and waiting until the silver plasma dries; thereafter, gradually increasing temperature of the glass from 30 °C ; when the temperature reaches 450~550 °C, thermally fully fusing the surface of the glass with the silver plasma; continuously increasing the temperature to 750 ~ 2% °C to temper the glass; and thereafter, gradually decreasing the temperature to room temperature to achieve a tempered glass circuit board. A circuit can be directly soldered on the surface of the tempered glass instead of any conductive tempered glass.

Affiliated with

Also associated with

Rating

Manufacturing method for tempered glass circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method for tempered glass circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for tempered glass circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1483425