Marked body and manufacturing method thereof

Details Marked body and manufacturing method thereof Marked body and manufacturing method thereof

G - Physics

02

B

G02B 27/34 (2006.01) B23Q 16/12 (2006.01) G02B 6/12 (2006.01) G02B 27/62 (2006.01)

Patent

CA 2622937

To provide a marked body that can bear the temperature of heat treatment that is required for a PLC. A lower clad layer, a marked body, a cylindrical part, a buried layer, and an upper clad layer are laminated on a silicon substrate. The marked body is formed with a void that is formed in the buried layer made with a silicon oxide film. Therefore, the heat resistance can be improved dramatically compared to a case of the marked body that is made of metal or the like. Moreover, the refractive index within the void is about 1, so that it is possible to have a sufficient difference between the diffractive index of the material of the periphery of the void and the diffractive index within the void. This makes it possible to achieve a high-contrast marked body.

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