Masking tape for electroplating processes

Details Masking tape for electroplating processes Masking tape for electroplating processes

C - Chemistry, Metallurgy

25

D

204/209, 204/12.

C25D 5/02 (2006.01) B32B 5/08 (2006.01) H05K 3/24 (2006.01) H05K 1/11 (2006.01)

Patent

CA 1219838

ABSTRACT OF THE DISCLOSURE A masking tape for partially covering the surfaces of an object, particularly a printed circuit board, to be electroplated by an electroplating process is provided. The masking tape comprises a foil-like carrier and a coating consisting of an adhesive material applied to one side of the foil-like carrier. At least one electrical conductor is arranged on the coating of the masking tape and forms a unit therewith. The electrical conductor connects the surfaces to be electroplated of the printed circuit board with one another and with a frame carried by the printed circuit board.

439836

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