Mass soldering apparatus

Details Mass soldering apparatus Mass soldering apparatus

B - Operations, Transporting

23

K

113/89

B23K 1/02 (1980.01)

Patent

CA 1124582

ABSTRACT OF THE DISCLOSURE: A system for mass soldering electrical and electronic components to a printed circuit board. The system includes means for applying a meltable material to the board so that the electrical and electronic components are temporarily coupled to the, board in pre-determined positions with the component leads extending through holes in the board. The material preferably is one which does not decompose at soldering temperature, but instead should have a melting point or liquidus temperature below that of the solder. The component leads may then be trimmed to finish length with the components in position on the board, and the components are then soldered in place in a soldering station. The meltable material melts and is displaced substantially simultaneously with the soldering. HOL-7/7A/10 Div. I Canada

293935

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