Mass soldering method and apparatus comprising solder reflow

Details Mass soldering method and apparatus comprising solder reflow Mass soldering method and apparatus comprising solder reflow

H - Electricity

05

K

356/22, 356/8

H05K 3/00 (2006.01) B23K 1/08 (2006.01) H05K 3/34 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1235823

ABSTRACT A method for mass joining, with solder, electrical and electronic components populating both sides of a circuit board comprises the steps of depositing a quantity of molten solder onto the bottom side surface of the board and components thereon and permitting the solder to solidify thereon, holding the board whereby to permit the heat energy on the bottom side surface of the board to rise through to the top side surface of the board and reach substantially maximum temperature due to heat transfer through the board and immediately thereafter heating the board top side surface to a temperature sufficient to reflow any solder preforms, solder creams or paste thereon.

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