Mass solderng system

Details Mass solderng system Mass solderng system

H - Electricity

05

K

356/22

H05K 3/34 (2006.01)

Patent

CA 1249069

ABSTRACT MASS SOLDERING SYSTEM A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The apparatus includes a pair of concentric slotted tubular shells wherein one shell rapidly rotates relative to about the other to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

521540

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