Mass solderng system

Details Mass solderng system Mass solderng system

B - Operations, Transporting

23

K

356/22, 356/8

B23K 1/00 (2006.01) B23K 1/08 (2006.01) B23K 31/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1249066

ABSTRACT MASS SOLDERING SYSTEM A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The impinging fluid stream is rapidly oscillated to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

521541

Affiliated with

Also associated with

Rating

Mass solderng system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mass solderng system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mass solderng system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1322134