Mass wave soldering system

Details Mass wave soldering system Mass wave soldering system

B - Operations, Transporting

23

K

113/89

B23K 1/02 (1980.01)

Patent

CA 1096241

ABSTRACT A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the-bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the- solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the - fluid stream. HOL-30B CANADA

314548

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