Mass wave soldering system

Details Mass wave soldering system Mass wave soldering system

B - Operations, Transporting

23

K

113/89

B23K 1/02 (1980.01)

Patent

CA 1091102

ABSTRACT A mass wave soldering system is described in which the circuit boards being soldered are transported on a conveyor moving in a horizontal travel path through the crest of a standing solder wave wherein the bottom of the boards are engaged with molten solder. A fluid stream is directed onto the bottom of the board substantially immediately after the board emerges from the solder wave. The fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board and any inter- connections, component leads and component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

314547

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