Master slice semiconductor device

Details Master slice semiconductor device Master slice semiconductor device

H - Electricity

01

L

356/132, 356/30

H01L 27/02 (2006.01) H01L 21/82 (2006.01) H01L 23/535 (2006.01) H01L 27/118 (2006.01)

Patent

CA 1213074

MASTER SLICE SEMICONDUCTOR DEVICE ABSTRACT OF THE DISCLOSURE A master slice semiconductor device comprising a plurality of basic cell arrays and a plurality of flip-flop cell arrays. The basic cell and flip-flop cell arrays are interconnected by strip-like diffused resistor regions with metal conductors via contact windows formed in an insulation layer on a bulk. The basic cell arrays, the flip-flop cell arrays, and the diffused resistor regions are buried in the bulk in advance. The diffused resistor regions are located in empty regions where lands, composing the basic cell and flip-flop cell arrays, are not formed in the bulk.

438823

Affiliated with

Also associated with

Rating

Master slice semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Master slice semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Master slice semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1225902