B - Operations – Transporting – 22 – F
Patent
B - Operations, Transporting
22
F
B22F 1/00 (2006.01) B22F 9/08 (2006.01) C22C 1/04 (2006.01) C23C 30/00 (2006.01)
Patent
CA 2609565
The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.
Doesburg Jacobus C.
Schmid Richard K.
Gowling Lafleur Henderson Llp
Sulzer Metco (us) Inc.
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