Material deposition

Details Material deposition Material deposition

C - Chemistry, Metallurgy

23

C

C23C 16/02 (2006.01) C23C 16/40 (2006.01) C23C 16/56 (2006.01) H01M 4/00 (2006.01) H01M 8/12 (2006.01)

Patent

CA 2336116

A method of material deposition of a desired material onto a substrate comprises the steps of: (i) depositing a surface-covering layer onto the substrate; (ii) depositing the desired material onto the surface-covering layer; and (iii) heating the substrate to a surface-covering removal temperature to remove at least some of the surface-covering layer. Steps (ii) and (iii) may be carried out together, so that the deposition of step (ii) may be carried out at least in part at the surface-covering-removal temperature.

Procédé servant à déposer un matériau désiré sur un substrat et consistant à (i) déposer une couche recouvrant la surface du substrat; (ii) déposer le matériau désiré sur cette couche; (iii) réchauffer le substrat à une température permettant de supprimer au moins une partie de la couche recouvrant la surface. Les étapes (ii) et (iii) peuvent être exécutées conjointement, de façon à pouvoir effectuer le dépôt de l'étape (ii) au moins en partie à la température de suppression de la couche recouvrant la surface.

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