Material for electronic components, method of connecting...

Details Material for electronic components, method of connecting... Material for electronic components, method of connecting...

H - Electricity

01

R

H01R 4/58 (2006.01) H01L 23/48 (2006.01) H01L 23/488 (2006.01) H01L 23/498 (2006.01) H01R 4/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2327810

A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.

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