Material for molding printed circuit board and printed...

Details Material for molding printed circuit board and printed... Material for molding printed circuit board and printed...

C - Chemistry, Metallurgy

08

L

400/4003, 400/65

C08L 101/00 (2006.01) C08L 21/00 (2006.01) C08L 25/04 (2006.01) C08L 27/18 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2024494

A material for molding printed circuit board, which is prepared by compounding 100 parts by weight of polymer composition consisting of 100 to 20 wt% of styrene polymers having a high degree of syndiotactic configuration (a) and 0 to 80 wt% of fibrous fillers (b) with 0 to 40 parts by weight of flame retardant (c) and 0 to 15 parts by weight of auxiliary flame retardant (d) , and a printed circuit board which is prepared by forming metallic foil on the molded product consisting of the material are disclosed.

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