Material removing arrangement

Details Material removing arrangement Material removing arrangement

B - Operations, Transporting

27

L

144/89

B27L 1/00 (2006.01) B27L 11/02 (2006.01)

Patent

CA 1111743

AN ARRANGEMENT FOR CUTTING WOOD INTO CHIPS Abstract of the Disclosure An arrangement for removing material from a workpiece, includes a support component for an elongated workpiece, and a tool component rotatable about an axis and having a circumferential cutting face and axial end faces. The tool component is supported at both end faces thereof. At least one of the above-mentioned components is movable relative to the other component in a predetermined path at least one of the path and axis of rotation is inclined relative to the elongation of a supported workpiece so that the workpiece contacts only the cutting face but does not contact the end faces of the tool component.

331324

Affiliated with

Also associated with

Rating

Material removing arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Material removing arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Material removing arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-521056