Material separation to form segmented product

Details Material separation to form segmented product Material separation to form segmented product

B - Operations, Transporting

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B

B32B 38/10 (2006.01) B31D 1/02 (2006.01) B32B 7/06 (2006.01) B32B 7/12 (2006.01) B32B 27/06 (2006.01) B32B 27/36 (2006.01) H01L 21/48 (2006.01) H01L 23/28 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2460577

A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.

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